Equipment & Process Engineer英语读写即可

1) Equipment management%D!S=0 
A) Overall control to equipments as individual equipments owner. ~7T`_kE 
A) Continuous improvement to OEE.JjoDv=H U 
A) Repairing by on call or shift on dutyWYr>p+v<L 
B) Preparation for PM document, service report.:yhH A3' 
B) Sourcing new equipment and spare parts to production

2) Process management>8|t)-D8 
A) Overall control to processes as individual process owner. 0lwn':Lt 
A) Continuous improvement to process capacity. @'^%Y[Op 
A) Develop new process introduction to productionD'C ->\DH 
B) Preparation for process document, validation report.

Professional CompetencesMBD`(~sG}\ 
 Solid understanding on Microelectronic technology W-S8[[JS 
 Practice and experience in Foundry, Wafer manufacturingJzonqf3 
 Practice and experience in Semiconductor Packaging Process<=#p-=t  
 Practice and experience in electronic product assembly technology

QualificationsG0J(JBce 
 Bachelor degree or above, major in Microelectronics\electronics=y4:k% 
 3 or more years semiconductor packaging production or related experience0K\{I[3\ 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesNw O3Gae 
 Ability to use analysis tools, like Minitabrll1v_l 
 Ability to use quality control tools, SPC, Six Sigma6c,%S'Qv1 
 Experience of lean manufacturingZ-9Yk
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 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510