Equipment & Process Engineer英语读写即可

1) Equipment management `-R`Yew 
A) Overall control to equipments as individual equipments owner. 7vQ#Ses 
A) Continuous improvement to OEE.37/VqrLQ6 
A) Repairing by on call or shift on dutybfbIsB'_#e 
B) Preparation for PM document, service report.ejSKzd 
B) Sourcing new equipment and spare parts to production

2) Process managementm.9)zt= 
A) Overall control to processes as individual process owner. C$z`-#b 
A) Continuous improvement to process capacity.uy%@fB}g 
A) Develop new process introduction to production[8iBIuaOV 
B) Preparation for process document, validation report.

Professional Competences{TZrD-^
 
 Solid understanding on Microelectronic technology DX|Hl4X 
 Practice and experience in Foundry, Wafer manufacturing$jKX+^j 
 Practice and experience in Semiconductor Packaging Process+T;W`4[y 
 Practice and experience in electronic product assembly technology

Qualificationsqb@WTe;,l 
 Bachelor degree or above, major in Microelectronics\electronicsIG1{$)Y 
 3 or more years semiconductor packaging production or related experience+} C oj' 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences#s_wJdU 
 Ability to use analysis tools, like Minitabpj6AzD]2 
 Ability to use quality control tools, SPC, Six SigmalE7
v-z 
 Experience of lean manufacturingv9OW.T8 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510