Equipment & Process Engineer英语读写即可

1) Equipment managementDNDYi2Q 
A) Overall control to equipments as individual equipments owner. /^! kp 
A) Continuous improvement to OEE.C O8xq 
A) Repairing by on call or shift on duty=7d - 
B) Preparation for PM document, service report.t.}b Soh 
B) Sourcing new equipment and spare parts to production

2) Process managementYX7P)m 
A) Overall control to processes as individual process owner. O1^JpZ+L 
A) Continuous improvement to process capacity.()pjDbd 
A) Develop new process introduction to production<z{s!6`%) 
B) Preparation for process document, validation report.

Professional Competencesxp3}tDnQ 
 Solid understanding on Microelectronic technology +GcSRS`
 
 Practice and experience in Foundry, Wafer manufacturingCokpUc 
 Practice and experience in Semiconductor Packaging Process $23nQN_#@ 
 Practice and experience in electronic product assembly technology

Qualifications >@B^]Qt 
 Bachelor degree or above, major in Microelectronics\electronics1^[)Og
K 
 3 or more years semiconductor packaging production or related experience@z#Xv8>=Hx 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences"-@o b ; 
 Ability to use analysis tools, like Minitabg_W\^/*p 
 Ability to use quality control tools, SPC, Six Sigma+S9hxYoG 
 Experience of lean manufacturing\T^L+LkD 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510