Equipment & Process Engineer英语读写即可

1) Equipment managementWyv Z@/W 
A) Overall control to equipments as individual equipments owner. -Lt]Em^}H 
A) Continuous improvement to OEE.Ip{@eX  
A) Repairing by on call or shift on duty))DDury 
B) Preparation for PM document, service report.u1Xi|qu~a 
B) Sourcing new equipment and spare parts to production

2) Process managementJ5k"b(s  
A) Overall control to processes as individual process owner. e'9>`N#B3 
A) Continuous improvement to process capacity.5>`=m 
A) Develop new process introduction to production6un23? 
B) Preparation for process document, validation report.

Professional Competencesw @@<U 
 Solid understanding on Microelectronic technology \ 7UF
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 Practice and experience in Foundry, Wafer manufacturing[\ /f7r 
 Practice and experience in Semiconductor Packaging ProcessSQ~YLkt 
 Practice and experience in electronic product assembly technology

QualificationsTq\7.\:. 
 Bachelor degree or above, major in Microelectronics\electronics[= 6UO43d 
 3 or more years semiconductor packaging production or related experience$et|G:U% 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences"U61ieFYi 
 Ability to use analysis tools, like Minitab/a1'{;[ 
 Ability to use quality control tools, SPC, Six Sigma3XnKx  < 
 Experience of lean manufacturingluwN2p{ 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510