Equipment & Process Engineer英语读写即可

1) Equipment managementT{9h>(U 
A) Overall control to equipments as individual equipments owner. M^UJ:G1a 
A) Continuous improvement to OEE.)tDevTFfke 
A) Repairing by on call or shift on duty:}u)J/^ 
B) Preparation for PM document, service report.1,0V+VCF\} 
B) Sourcing new equipment and spare parts to production

2) Process management ^](  
A) Overall control to processes as individual process owner. n5ZLV&` 
A) Continuous improvement to process capacity.5TSU@Y% r 
A) Develop new process introduction to productionN;/CT 
B) Preparation for process document, validation report.

Professional CompetencesDIHUVAy 
 Solid understanding on Microelectronic technology ||.Tj0>  
 Practice and experience in Foundry, Wafer manufacturingHV~fc  
 Practice and experience in Semiconductor Packaging ProcessItK
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 Practice and experience in electronic product assembly technology

Qualifications tt/]ktV 
 Bachelor degree or above, major in Microelectronics\electronicsglZuB2 
 3 or more years semiconductor packaging production or related experience3q~mL%N'\ 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencest"856 
 Ability to use analysis tools, like Minitab8S#x@Bg] 
 Ability to use quality control tools, SPC, Six SigmajX9_6Rk1 
 Experience of lean manufacturingp/ _t4Yl 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510