Equipment & Process Engineer英语读写即可

1) Equipment management1eEZkwC> 
A) Overall control to equipments as individual equipments owner. DH%q{cz< 
A) Continuous improvement to OEE.7h'@ds2 
A) Repairing by on call or shift on dutyZ2dx=k"s} 
B) Preparation for PM document, service report.Nv7@6T*F 
B) Sourcing new equipment and spare parts to production

2) Process managementgQ)jW.6< 
A) Overall control to processes as individual process owner. T!'idJ`^d4 
A) Continuous improvement to process capacity.kfFv 3Tt[ 
A) Develop new process introduction to productionL$W[4Co 7 
B) Preparation for process document, validation report.

Professional Competences\nSXM+ HE 
 Solid understanding on Microelectronic technology 3UP/2gn 
 Practice and experience in Foundry, Wafer manufacturing*l'uL[vNm 
 Practice and experience in Semiconductor Packaging ProcessjKNW& 
 Practice and experience in electronic product assembly technology

QualificationsQ&s Ic@9 
 Bachelor degree or above, major in Microelectronics\electronics%iw\tE>d^k 
 3 or more years semiconductor packaging production or related experience8S,bm` 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences|kOo2m rle 
 Ability to use analysis tools, like MinitabLxh@bJ# 
 Ability to use quality control tools, SPC, Six SigmaokMoA 
 Experience of lean manufacturingzVi.(Z9 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510