Equipment & Process Engineer英语读写即可

1) Equipment managementMS :lOZP: 
A) Overall control to equipments as individual equipments owner. S@:\>B`]6 
A) Continuous improvement to OEE.J?;g1~tj 
A) Repairing by on call or shift on dutyJP Vr'xbf 
B) Preparation for PM document, service report.tUT( 
B) Sourcing new equipment and spare parts to production

2) Process management JkPd$E 
A) Overall control to processes as individual process owner. -*H5nS 
A) Continuous improvement to process capacity.k`]iW5)jO 
A) Develop new process introduction to production[kYq!@P! 
B) Preparation for process document, validation report.

Professional Competences_%hbJX8m 
 Solid understanding on Microelectronic technology 0\D -=|M 
 Practice and experience in Foundry, Wafer manufacturing='|lrz^ 
 Practice and experience in Semiconductor Packaging Process/N#l9y,o  
 Practice and experience in electronic product assembly technology

QualificationsW8-XoFz 
 Bachelor degree or above, major in Microelectronics\electronicsk+[DdI9mC? 
 3 or more years semiconductor packaging production or related experience_A% x -FSd 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences!~OAVIj ` 
 Ability to use analysis tools, like MinitabK[cg b 
 Ability to use quality control tools, SPC, Six Sigma@%_G}F-]r 
 Experience of lean manufacturingz>XAqiRCF 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510