Equipment & Process Engineer英语读写即可

1) Equipment management]sV^X1~w 
A) Overall control to equipments as individual equipments owner. OE>g 
A) Continuous improvement to OEE.=0J{I'x 
A) Repairing by on call or shift on dutyN\Y` OT 
B) Preparation for PM document, service report.j&j|; 
B) Sourcing new equipment and spare parts to production

2) Process management>9;,6E=cod 
A) Overall control to processes as individual process owner. xWa:a 
A) Continuous improvement to process capacity.IqX%y_  
A) Develop new process introduction to production]0K;,w z 
B) Preparation for process document, validation report.

Professional CompetencesQIc+>tK 
 Solid understanding on Microelectronic technology b,>m&'f~j 
 Practice and experience in Foundry, Wafer manufacturingLQ0" ?Gi 
 Practice and experience in Semiconductor Packaging ProcessD5GW~ 
 Practice and experience in electronic product assembly technology

Qualificationsls2$ 
 Bachelor degree or above, major in Microelectronics\electronicsF0G4o?P66 
 3 or more years semiconductor packaging production or related experiencem?D_2D 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesb"
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 Ability to use analysis tools, like Minitabm{8zyCH 
 Ability to use quality control tools, SPC, Six SigmaAVz(RlLnoo 
 Experience of lean manufacturing@_6jl>C!h 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510