Equipment & Process Engineer英语读写即可

1) Equipment management-bQ#0"; 
A) Overall control to equipments as individual equipments owner. }I(H$7|| 
A) Continuous improvement to OEE.@47&VT@ 
A) Repairing by on call or shift on duty q=NnqAY; 
B) Preparation for PM document, service report.Q'gS31B7a 
B) Sourcing new equipment and spare parts to production

2) Process managementog4K]u 
A) Overall control to processes as individual process owner. ]aq[D5 B 
A) Continuous improvement to process capacity.oU[w_ 
A) Develop new process introduction to productionO{v<1Q>P 
B) Preparation for process document, validation report.

Professional CompetencesC 8 7&o 
 Solid understanding on Microelectronic technology Xr:5C_W 
 Practice and experience in Foundry, Wafer manufacturing%a;)0Y  
 Practice and experience in Semiconductor Packaging Processl]p/*=[ 
 Practice and experience in electronic product assembly technology

Qualifications_(q>ys}y 
 Bachelor degree or above, major in Microelectronics\electronics"I p`PJF 
 3 or more years semiconductor packaging production or related experienceZ4$l3.{\w 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesOZp'V~r 
 Ability to use analysis tools, like Minitab@> 3LtF0 
 Ability to use quality control tools, SPC, Six Sigma MA5ARG 
 Experience of lean manufacturing4&-6*hwjW 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510