Equipment & Process Engineer英语读写即可

1) Equipment management+wG+G^-al, 
A) Overall control to equipments as individual equipments owner. <Nw FN? 
A) Continuous improvement to OEE.ZPT7o7Y8dz 
A) Repairing by on call or shift on dutyY`iE4FR+s 
B) Preparation for PM document, service report.:oK\* 
B) Sourcing new equipment and spare parts to production

2) Process management}G ).bP 
A) Overall control to processes as individual process owner. ]?U8rX| _ 
A) Continuous improvement to process capacity.za"Lb  
A) Develop new process introduction to production"N
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B) Preparation for process document, validation report.

Professional Competences{/,q)_g5 
 Solid understanding on Microelectronic technology ;H5I wt6s 
 Practice and experience in Foundry, Wafer manufacturing+P6| y 
 Practice and experience in Semiconductor Packaging Process=eJ<5T 
 Practice and experience in electronic product assembly technology

Qualificationsb\_3(FEv. 
 Bachelor degree or above, major in Microelectronics\electronicscb^ui!b 
 3 or more years semiconductor packaging production or related experienceZ#WU1+F 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesRZ=1Hn>Z^g 
 Ability to use analysis tools, like MinitabqSJMlP/# 
 Ability to use quality control tools, SPC, Six Sigma{faQc
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 Experience of lean manufacturing# ,mz%b 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510