Equipment & Process Engineer英语读写即可

1) Equipment management"sNW7s!F 
A) Overall control to equipments as individual equipments owner. bH s=  
A) Continuous improvement to OEE..]:XrC;Z 
A) Repairing by on call or shift on dutyh!I3zWl 
B) Preparation for PM document, service report.<V*(j`9 
B) Sourcing new equipment and spare parts to production

2) Process management_TT$}L5!N 
A) Overall control to processes as individual process owner. l!G%.t6_N< 
A) Continuous improvement to process capacity.\Gu=2$
 
A) Develop new process introduction to production!(Kj#pVh 
B) Preparation for process document, validation report.

Professional Competences# [UOKo 
 Solid understanding on Microelectronic technology 8G2
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 Practice and experience in Foundry, Wafer manufacturingv^N,.,FW 
 Practice and experience in Semiconductor Packaging Processs1SvcBZ 
 Practice and experience in electronic product assembly technology

QualificationsV@ _H1}e$] 
 Bachelor degree or above, major in Microelectronics\electronicsZ;D$f
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 3 or more years semiconductor packaging production or related experience<;!'fs
 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences\y$-Hqy G} 
 Ability to use analysis tools, like Minitabpurdm$] 
 Ability to use quality control tools, SPC, Six SigmaX(Znay 
 Experience of lean manufacturing/X7Uw7$ 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510