Equipment & Process Engineer英语读写即可

1) Equipment management fG [#& 
A) Overall control to equipments as individual equipments owner. 3Y[ & &^eF 
A) Continuous improvement to OEE.Z5~PK(UZD5 
A) Repairing by on call or shift on duty`%;uA53| 
B) Preparation for PM document, service report.CUc?EUt :z 
B) Sourcing new equipment and spare parts to production

2) Process managementPM\<rd`+EU 
A) Overall control to processes as individual process owner. rVv``X:& 
A) Continuous improvement to process capacity.SOhwgT||Lz 
A) Develop new process introduction to production$?9S0UWMn 
B) Preparation for process document, validation report.

Professional Competences
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 Solid understanding on Microelectronic technology 0Px8k@+$ 
 Practice and experience in Foundry, Wafer manufacturinggonrojf 
 Practice and experience in Semiconductor Packaging ProcessuF,6X3 
 Practice and experience in electronic product assembly technology

Qualifications&Jpt 
 Bachelor degree or above, major in Microelectronics\electronics~5=69V!Qn& 
 3 or more years semiconductor packaging production or related experience ;b`m< 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesaaU*;lHc 
 Ability to use analysis tools, like MinitabmqcTO 
 Ability to use quality control tools, SPC, Six Sigma3@+[Ze8 
 Experience of lean manufacturing.a8%KcE] 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510