Equipment & Process Engineer英语读写即可

1) Equipment managementiOYhs{x|`* 
A) Overall control to equipments as individual equipments owner. JzGx^Dd~' 
A) Continuous improvement to OEE.mec^'0Iw 
A) Repairing by on call or shift on dutyDg.'nw >> 
B) Preparation for PM document, service report.uR&"$}?)xw 
B) Sourcing new equipment and spare parts to production

2) Process management#O00Q9^M8 
A) Overall control to processes as individual process owner. r70%DL; 
A) Continuous improvement to process capacity.3Gd*VYIh
 
A) Develop new process introduction to production$pFyi>
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B) Preparation for process document, validation report.

Professional Competencesax]&n47q 
 Solid understanding on Microelectronic technology `}_TSY 
 Practice and experience in Foundry, Wafer manufacturing;9jfKP 
 Practice and experience in Semiconductor Packaging Processm^B0F 
 Practice and experience in electronic product assembly technology

Qualifications&)cz^'b'c 
 Bachelor degree or above, major in Microelectronics\electronicsI`n$cTB 
 3 or more years semiconductor packaging production or related experience|v}$]9` 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences*xEd/Iy 
 Ability to use analysis tools, like MinitabnX7XdP  
 Ability to use quality control tools, SPC, Six SigmaNav( $;'E 
 Experience of lean manufacturingxMlb#:xh 
 Fluent English communication skill

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MSN ：tangku6@hotmail.com

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