Equipment & Process Engineer英语读写即可

1) Equipment managementKiC;wff 
A) Overall control to equipments as individual equipments owner. ^~S[6 *E? 
A) Continuous improvement to OEE.zb4P/mQB 
A) Repairing by on call or shift on duty{$Qo5<G[ 
B) Preparation for PM document, service report.+WM0I]>=AV 
B) Sourcing new equipment and spare parts to production

2) Process management"!J{o\=b\ 
A) Overall control to processes as individual process owner. A7i[,t)Q 
A) Continuous improvement to process capacity.%Xm{& 
A) Develop new process introduction to production$-*Ca>zm 
B) Preparation for process document, validation report.

Professional Competences!$eXbxlL 
 Solid understanding on Microelectronic technology g.qJ!x'E 
 Practice and experience in Foundry, Wafer manufacturingE*@-dn" 
 Practice and experience in Semiconductor Packaging ProcessQr]c- o|z 
 Practice and experience in electronic product assembly technology

Qualifications|@gj|;{ 
 Bachelor degree or above, major in Microelectronics\electronics=Zj*Bh0 
 3 or more years semiconductor packaging production or related experienceJ$0!9w x~y 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences-V/wV.X 
 Ability to use analysis tools, like Minitab5@|C#4Ek# 
 Ability to use quality control tools, SPC, Six Sigma9o xv> 69 
 Experience of lean manufacturingUP8[yh+0 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510