Equipment & Process Engineer英语读写即可

1) Equipment management0x]*y*82 
A) Overall control to equipments as individual equipments owner. ,4!uz?w(gv 
A) Continuous improvement to OEE.VaWbS 
A) Repairing by on call or shift on dutyq' gZJ%USa 
B) Preparation for PM document, service report.}viBnOZ0y 
B) Sourcing new equipment and spare parts to production

2) Process managementqO;D3 BDs 
A) Overall control to processes as individual process owner. -boae?P=r 
A) Continuous improvement to process capacity.G/a(fO 
A) Develop new process introduction to productionkz?n(v,\a 
B) Preparation for process document, validation report.

Professional CompetencesK"U+; V 
 Solid understanding on Microelectronic technology pi=:~>UlD 
 Practice and experience in Foundry, Wafer manufacturingBz)p"3. 
 Practice and experience in Semiconductor Packaging Processe>,~h*d
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 Practice and experience in electronic product assembly technology

Qualifications%d7g|.H>p. 
 Bachelor degree or above, major in Microelectronics\electronics0:=&~-l7 
 3 or more years semiconductor packaging production or related experience:Q^lv$I% 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesn-G<n  &, 
 Ability to use analysis tools, like MinitabVTZVnl*B 
 Ability to use quality control tools, SPC, Six Sigma<#F8*/"h 
 Experience of lean manufacturingFg3HNz?1o 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510