Equipment & Process Engineer英语读写即可

1) Equipment managementX5:*pQ 
A) Overall control to equipments as individual equipments owner. n|Lr j> 
A) Continuous improvement to OEE.).i.-= 
A) Repairing by on call or shift on duty*0-d}K.ak 
B) Preparation for PM document, service report.NTU^;3xLG 
B) Sourcing new equipment and spare parts to production

2) Process managementHIcM#rj8 
A) Overall control to processes as individual process owner. J=tCf_zy` 
A) Continuous improvement to process capacity.z
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A) Develop new process introduction to productioneLPqFiX}y 
B) Preparation for process document, validation report.

Professional Competences8V"q(22a<\ 
 Solid understanding on Microelectronic technology p2d*M:{? 
 Practice and experience in Foundry, Wafer manufacturingyjKD[`%UY- 
 Practice and experience in Semiconductor Packaging Process $w}f[ 
 Practice and experience in electronic product assembly technology

Qualificationst)Y 
 Bachelor degree or above, major in Microelectronics\electronicso?%$'3A5  
 3 or more years semiconductor packaging production or related experiencejW_@U x 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesjPWC*AB6+ 
 Ability to use analysis tools, like MinitabPS-5kf2< 
 Ability to use quality control tools, SPC, Six SigmaK&
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 Experience of lean manufacturingKh\z

, 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510