Equipment & Process Engineer英语读写即可

1) Equipment management?D4?LvX_7Z 
A) Overall control to equipments as individual equipments owner. \Njm$V_-
 
A) Continuous improvement to OEE.iTGucf%q 
A) Repairing by on call or shift on dutyWjTWRV 
B) Preparation for PM document, service report.=zqet 
B) Sourcing new equipment and spare parts to production

2) Process managementbuV+Y!> 
A) Overall control to processes as individual process owner. Zs0 )-AwqB 
A) Continuous improvement to process capacity.LZ|cpP_ 
A) Develop new process introduction to productionCP-2,D1 
B) Preparation for process document, validation report.

Professional Competences6]ME,3< 
 Solid understanding on Microelectronic technology )_5T618 
 Practice and experience in Foundry, Wafer manufacturingJdL"A> 
 Practice and experience in Semiconductor Packaging Process@Ipmxq 
 Practice and experience in electronic product assembly technology

Qualifications>9 w$z/ 
 Bachelor degree or above, major in Microelectronics\electronicsj]M j  
 3 or more years semiconductor packaging production or related experience27[z\ R 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesZ
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 Ability to use analysis tools, like MinitabT$DqmQaY 
 Ability to use quality control tools, SPC, Six Sigma9Y\Q`YC9W 
 Experience of lean manufacturingj#+ q~]t 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510