Equipment & Process Engineer英语读写即可

1) Equipment managementP<D@iV 
A) Overall control to equipments as individual equipments owner. IdhRt(y S? 
A) Continuous improvement to OEE. UIVTu)#S 
A) Repairing by on call or shift on dutyqAL"F4"( 
B) Preparation for PM document, service report.5:rt*M~u 
B) Sourcing new equipment and spare parts to production

2) Process managementb?Rft< 
A) Overall control to processes as individual process owner. T~9vmEX6+@ 
A) Continuous improvement to process capacity.PW~X_IZbv 
A) Develop new process introduction to production8mBxD^ 
B) Preparation for process document, validation report.

Professional CompetencesxWbwC="-Mw 
 Solid understanding on Microelectronic technology %<;$n/qFi} 
 Practice and experience in Foundry, Wafer manufacturing8Z[B2hY{  
 Practice and experience in Semiconductor Packaging Processe7*09K' 
 Practice and experience in electronic product assembly technology

Qualifications/~M-{Sp 
 Bachelor degree or above, major in Microelectronics\electronicsf/6K)o,kCB 
 3 or more years semiconductor packaging production or related experience 5h
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 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences/6*!k5 
 Ability to use analysis tools, like Minitab1&\0u$EFO 
 Ability to use quality control tools, SPC, Six SigmaE2c G4 
 Experience of lean manufacturingWwEK@,sb 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510