Equipment & Process Engineer英语读写即可

1) Equipment managementEs+<nu6C 
A) Overall control to equipments as individual equipments owner. $K1NBK> 
A) Continuous improvement to OEE.0dwhPae 
A) Repairing by on call or shift on dutyNlobdO"[ 
B) Preparation for PM document, service report.N3dU\)<  
B) Sourcing new equipment and spare parts to production

2) Process managementw<y-9`  
A) Overall control to processes as individual process owner. QX;V0U 
A) Continuous improvement to process capacity._~  qwo78 
A) Develop new process introduction to production<l/Vh# 
B) Preparation for process document, validation report.

Professional CompetencesE=wkP{\. 
 Solid understanding on Microelectronic technology 'jruM F 
 Practice and experience in Foundry, Wafer manufacturing[t/K= 
 Practice and experience in Semiconductor Packaging ProcessRR`m)k 
 Practice and experience in electronic product assembly technology

Qualifications'r\\;> 
 Bachelor degree or above, major in Microelectronics\electronics"jkg `}%*4 
 3 or more years semiconductor packaging production or related experiencezzJ*lY 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesYe<b*k]7 
 Ability to use analysis tools, like Minitabc&XG`
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 Ability to use quality control tools, SPC, Six Sigma+kze2$h.D 
 Experience of lean manufacturing_,A{,C] 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510