Equipment & Process Engineer英语读写即可

1) Equipment managementpYf>fw+7kn 
A) Overall control to equipments as individual equipments owner. 1Csvzo 
A) Continuous improvement to OEE.xNm3_~4wW 
A) Repairing by on call or shift on dutyPp_."Q#i 
B) Preparation for PM document, service report.`\#`AWh 
B) Sourcing new equipment and spare parts to production

2) Process management7Y\={,IM) 
A) Overall control to processes as individual process owner. c_]s}Z 
A) Continuous improvement to process capacity.[T].'0 
A) Develop new process introduction to production|7y~yv - 
B) Preparation for process document, validation report.

Professional CompetenceskN 1=^0 
 Solid understanding on Microelectronic technology _3,*q{oe1J 
 Practice and experience in Foundry, Wafer manufacturing/tCyK6 
 Practice and experience in Semiconductor Packaging Processk\OokR ka 
 Practice and experience in electronic product assembly technology

Qualificationsk2y_w1mz 
 Bachelor degree or above, major in Microelectronics\electronics'X$@]< 
 3 or more years semiconductor packaging production or related experienceIuM{\Dc 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesN$cH@ FA 
 Ability to use analysis tools, like Minitab"$yKm% 
 Ability to use quality control tools, SPC, Six SigmaJ45#]:1,N} 
 Experience of lean manufacturing"tx
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 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510