Equipment & Process Engineer英语读写即可

1) Equipment managementq0F* 
A) Overall control to equipments as individual equipments owner. ~3O$)7I\$ 
A) Continuous improvement to OEE./&.Gvg 
A) Repairing by on call or shift on dutyk@ T,>= 
B) Preparation for PM document, service report.&%s4:ld 
B) Sourcing new equipment and spare parts to production

2) Process managementEl:HeTA* 
A) Overall control to processes as individual process owner. 7S<l=MzN9 
A) Continuous improvement to process capacity.DX[i un 
A) Develop new process introduction to production+@Yn_-S 
B) Preparation for process document, validation report.

Professional Competences=.AlR'XR
 
 Solid understanding on Microelectronic technology rm*w$$?E 
 Practice and experience in Foundry, Wafer manufacturingX7 `]f]:b 
 Practice and experience in Semiconductor Packaging Processu01$uC66 
 Practice and experience in electronic product assembly technology

Qualifications3d~C|T 
 Bachelor degree or above, major in Microelectronics\electronics,BRh7#P= 
 3 or more years semiconductor packaging production or related experiencei a-|O1'm 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesot?d~j*b 
 Ability to use analysis tools, like Minitabh~N%L@' 
 Ability to use quality control tools, SPC, Six SigmaAL|nJ!VM 
 Experience of lean manufacturing9`w/=aU 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510