Equipment & Process Engineer英语读写即可

1) Equipment managementH|d *o 
A) Overall control to equipments as individual equipments owner. ]3vpGUk 
A) Continuous improvement to OEE. <GbQWjb< 
A) Repairing by on call or shift on dutyU2,*XYi 
B) Preparation for PM document, service report.;O5Av.( 
B) Sourcing new equipment and spare parts to production

2) Process managementWm +v}i 
A) Overall control to processes as individual process owner. /E%Yjh  
A) Continuous improvement to process capacity.Mk 7?pe 
A) Develop new process introduction to productionX[KQ$|b7 
B) Preparation for process document, validation report.

Professional Competences=CiUQ H 
 Solid understanding on Microelectronic technology %L74.(+ 
 Practice and experience in Foundry, Wafer manufacturing;Pa~
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 Practice and experience in Semiconductor Packaging ProcessM4Pa?%G4 
 Practice and experience in electronic product assembly technology

QualificationsO:q]9} 
 Bachelor degree or above, major in Microelectronics\electronicsj%Qh9)6P 
 3 or more years semiconductor packaging production or related experience/WMWw-`S 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesDE-)X}y 
 Ability to use analysis tools, like Minitab$UX?_iq 
 Ability to use quality control tools, SPC, Six Sigma k{qX% 
 Experience of lean manufacturing?3 qe[ 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510