Equipment & Process Engineer英语读写即可

1) Equipment management p"70jbs 
A) Overall control to equipments as individual equipments owner. v$tZoJ!T 
A) Continuous improvement to OEE.CH 0JywZ 
A) Repairing by on call or shift on duty8,dpc(6 
B) Preparation for PM document, service report.sx=2R:: ^ 
B) Sourcing new equipment and spare parts to production

2) Process managementq`T6o}d9RV 
A) Overall control to processes as individual process owner. aQY4TMT 
A) Continuous improvement to process capacity.J_wMrH,Q 
A) Develop new process introduction to production4yFN{QGPV 
B) Preparation for process document, validation report.

Professional Competencesh/ Ml5
 
 Solid understanding on Microelectronic technology g J}*f>S 
 Practice and experience in Foundry, Wafer manufacturingbliCdOt 
 Practice and experience in Semiconductor Packaging Process/o9HsQ: 
 Practice and experience in electronic product assembly technology

QualificationsjYL)9]2 
 Bachelor degree or above, major in Microelectronics\electronics,hqPB 
 3 or more years semiconductor packaging production or related experience=Ot:8_g 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences_R3\4:= 
 Ability to use analysis tools, like MinitabWdmj^V7%L! 
 Ability to use quality control tools, SPC, Six SigmaPG-9 !M 
 Experience of lean manufacturingLTXJ
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 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510