Equipment & Process Engineer英语读写即可

1) Equipment managementan:r`R0# 
A) Overall control to equipments as individual equipments owner. T;.g?S?3 
A) Continuous improvement to OEE.zF@Y&#XN 
A) Repairing by on call or shift on duty`C@ZDCJcn 
B) Preparation for PM document, service report.2 @8aes N 
B) Sourcing new equipment and spare parts to production

2) Process managementaP 0-F< 
A) Overall control to processes as individual process owner.  V09cH@: 
A) Continuous improvement to process capacity.2b+(g+J 
A) Develop new process introduction to production3`DkUlzZr 
B) Preparation for process document, validation report.

Professional Competenceso@Vx>#EV 
 Solid understanding on Microelectronic technology [^FdEklT 
 Practice and experience in Foundry, Wafer manufacturingK)m'6@ZmO 
 Practice and experience in Semiconductor Packaging Process85OYN7\w 
 Practice and experience in electronic product assembly technology

QualificationsoL"Wokh 
 Bachelor degree or above, major in Microelectronics\electronics?H{2|W""5 
 3 or more years semiconductor packaging production or related experience0^p Fa( 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesIbA?S] 
 Ability to use analysis tools, like MinitabdNd@C5?y 
 Ability to use quality control tools, SPC, Six Sigmae
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 Experience of lean manufacturing?l5~X 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510