Equipment & Process Engineer英语读写即可

1) Equipment management9ll>W.Z 
A) Overall control to equipments as individual equipments owner. z/t;Ac/j 
A) Continuous improvement to OEE.0XLp\]k_$a 
A) Repairing by on call or shift on dutyY#\ 6yDK] 
B) Preparation for PM document, service report.#4S^]r 
B) Sourcing new equipment and spare parts to production

2) Process management[zzX&Rkb) 
A) Overall control to processes as individual process owner. -jhv:
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A) Continuous improvement to process capacity.Gyu,L/ 
A) Develop new process introduction to productionV[cKn[mhv 
B) Preparation for process document, validation report.

Professional CompetencesDu.jJ>8 
 Solid understanding on Microelectronic technology zS`F)e 
 Practice and experience in Foundry, Wafer manufacturingXf "8o_d3[ 
 Practice and experience in Semiconductor Packaging Process+8 QaD$R 
 Practice and experience in electronic product assembly technology

QualificationsVL[h423 
 Bachelor degree or above, major in Microelectronics\electronicsw]AoE 
 3 or more years semiconductor packaging production or related experience+sx
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 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesnR|K$,<cz) 
 Ability to use analysis tools, like Minitab4mLFWA|a 
 Ability to use quality control tools, SPC, Six Sigmal8Iu{
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 Experience of lean manufacturing~N\[:.(7c 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510