Equipment & Process Engineer英语读写即可

1) Equipment management1?]{wZ] 
A) Overall control to equipments as individual equipments owner. } Og' 
A) Continuous improvement to OEE.|qO;erlh 
A) Repairing by on call or shift on duty,+Rc T% zJ 
B) Preparation for PM document, service report.-w%7? pyn 
B) Sourcing new equipment and spare parts to production

2) Process management 61.HeF 
A) Overall control to processes as individual process owner. H,KrK~i 
A) Continuous improvement to process capacity.[W~g{? 
A) Develop new process introduction to productionbef-6K L 
B) Preparation for process document, validation report.

Professional Competencesard A6Ntp 
 Solid understanding on Microelectronic technology (`@X@R 
 Practice and experience in Foundry, Wafer manufacturingb/S=f[
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 Practice and experience in Semiconductor Packaging Process+|kiHNcc_V 
 Practice and experience in electronic product assembly technology

Qualificationspu:Q~YU#T 
 Bachelor degree or above, major in Microelectronics\electronics3tf7fB:f> 
 3 or more years semiconductor packaging production or related experience[7Q&[.Z 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesvFW-nxA 
 Ability to use analysis tools, like Minitab<xY(mYgw 
 Ability to use quality control tools, SPC, Six Sigma85_!@2[X 
 Experience of lean manufacturingy  
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 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510