Equipment & Process Engineer英语读写即可

1) Equipment managementL2ON0sH(T 
A) Overall control to equipments as individual equipments owner. Z#Vl+*H6y 
A) Continuous improvement to OEE.5/;<O* :q 
A) Repairing by on call or shift on duty{k06] 
B) Preparation for PM document, service report.$% ,
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B) Sourcing new equipment and spare parts to production

2) Process managementnm6RXPyC 
A) Overall control to processes as individual process owner. L/o}+s] 
A) Continuous improvement to process capacity.)7'Qqg"N 
A) Develop new process introduction to production|+mwa({\ 
B) Preparation for process document, validation report.

Professional CompetencesFY,x=RP 
 Solid understanding on Microelectronic technology W]|SWa 
 Practice and experience in Foundry, Wafer manufacturingbK"[$c? 
 Practice and experience in Semiconductor Packaging Process;w)"{\_,8 
 Practice and experience in electronic product assembly technology

Qualificationskde\#jT;; 
 Bachelor degree or above, major in Microelectronics\electronicsfL>TmE- 
 3 or more years semiconductor packaging production or related experiencew="6g*9 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesF^ZN # 
 Ability to use analysis tools, like Minitab5{\c?vA% 
 Ability to use quality control tools, SPC, Six SigmaOKpS}B8[f 
 Experience of lean manufacturingqF%$@{( 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

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