Equipment & Process Engineer英语读写即可

1) Equipment management uWfgfj 
A) Overall control to equipments as individual equipments owner. N}\eJnj]U 
A) Continuous improvement to OEE.%T}CCv*qbV 
A) Repairing by on call or shift on dutyS_6L#].`I 
B) Preparation for PM document, service report.MNdQW/07r 
B) Sourcing new equipment and spare parts to production

2) Process management'0
OR\bg*^ 
A) Overall control to processes as individual process owner. MI`=xR`
 
A) Continuous improvement to process capacity."&D %GR 
A) Develop new process introduction to productionk?(? 60 
B) Preparation for process document, validation report.

Professional CompetencesI*IOh7 
 Solid understanding on Microelectronic technology Rv%;wi%R~. 
 Practice and experience in Foundry, Wafer manufacturing!#Wf$$#1] 
 Practice and experience in Semiconductor Packaging Process B1R KFc 
 Practice and experience in electronic product assembly technology

QualificationsB W;*<.`6 
 Bachelor degree or above, major in Microelectronics\electronicsb+e>t>! 
 3 or more years semiconductor packaging production or related experiencez jD3 G}) 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesv6]nrCh
 
 Ability to use analysis tools, like MinitabR KJ>sQ 
 Ability to use quality control tools, SPC, Six Sigma@H>|R0wp~ 
 Experience of lean manufacturing|+uuB[D 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510