Equipment & Process Engineer英语读写即可

1) Equipment managementyBJ]n\kA 
A) Overall control to equipments as individual equipments owner. [2yI~ i [ 
A) Continuous improvement to OEE.qU`2 Ar 
A) Repairing by on call or shift on duty g)G3X 
B) Preparation for PM document, service report.mI'XT 
B) Sourcing new equipment and spare parts to production

2) Process managementl? bK3r s 
A) Overall control to processes as individual process owner. bzc2B_#a: 
A) Continuous improvement to process capacity._e0RuV! 
A) Develop new process introduction to production$g[zX& 
B) Preparation for process document, validation report.

Professional Competencesz$OFOA*) 
 Solid understanding on Microelectronic technology |knE(\n1 
 Practice and experience in Foundry, Wafer manufacturing:Liy'

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 Practice and experience in Semiconductor Packaging Process1yS*~?T 
 Practice and experience in electronic product assembly technology

QualificationsV
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 Bachelor degree or above, major in Microelectronics\electronicsA0t `XQ 
 3 or more years semiconductor packaging production or related experience2FmqP 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences&U@MFCa_ 
 Ability to use analysis tools, like Minitab>.(3oIy2 
 Ability to use quality control tools, SPC, Six SigmajUL
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 Experience of lean manufacturing&q(@`j*( 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510