Equipment & Process Engineer英语读写即可

1) Equipment managementTf&'~/E 
A) Overall control to equipments as individual equipments owner. W/:umL{] 
A) Continuous improvement to OEE.aC a8p@ c 
A) Repairing by on call or shift on duty*UJweb* 
B) Preparation for PM document, service report.Yx`DStkz 
B) Sourcing new equipment and spare parts to production

2) Process managementsn3=QN  
A) Overall control to processes as individual process owner. zFn
}WeQ 
A) Continuous improvement to process capacity.w*Nc%oA=] 
A) Develop new process introduction to production'XdI:D5 
B) Preparation for process document, validation report.

Professional Competencesp _ lHHJ 
 Solid understanding on Microelectronic technology GMIn:2); 
 Practice and experience in Foundry, Wafer manufacturing37Pn9 Vk 
 Practice and experience in Semiconductor Packaging ProcessR;5\NZ7# 
 Practice and experience in electronic product assembly technology

QualificationsW{f R+01 
 Bachelor degree or above, major in Microelectronics\electronics~{x"<0>O 
 3 or more years semiconductor packaging production or related experiencef*bH@kr)J 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences#HOq\Oih-2 
 Ability to use analysis tools, like MinitabU:3>?W)( 
 Ability to use quality control tools, SPC, Six Sigmao\=Phq"v- 
 Experience of lean manufacturingb)f6 H 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510