Equipment & Process Engineer英语读写即可

1) Equipment management>K}S^N? 
A) Overall control to equipments as individual equipments owner. Al []8 
A) Continuous improvement to OEE.lz&](8Y 
A) Repairing by on call or shift on dutyJ`+"L'Whe 
B) Preparation for PM document, service report.r00X--=CHR 
B) Sourcing new equipment and spare parts to production

2) Process management0*n}o 
A) Overall control to processes as individual process owner. L# Mos W 
A) Continuous improvement to process capacity.b?=!fe8 
A) Develop new process introduction to productionKpV#)2 
B) Preparation for process document, validation report.

Professional Competences8T2}ci]c 
 Solid understanding on Microelectronic technology F3N -g*xD 
 Practice and experience in Foundry, Wafer manufacturingC}>&Pb0B3 
 Practice and experience in Semiconductor Packaging ProcessF 2M) e\U 
 Practice and experience in electronic product assembly technology

Qualificationsad'r,si 
 Bachelor degree or above, major in Microelectronics\electronicsXbVf'#. Yz 
 3 or more years semiconductor packaging production or related experience=^@(|w}S 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencess}>W]+ 
 Ability to use analysis tools, like Minitab/3^b"Y*UO7 
 Ability to use quality control tools, SPC, Six Sigmat!;@],D*OL 
 Experience of lean manufacturingO5+h*~1< 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510