Equipment & Process Engineer英语读写即可

1) Equipment managementURUSF 
A) Overall control to equipments as individual equipments owner. +2-TDN 
A) Continuous improvement to OEE.G<VVWX 
A) Repairing by on call or shift on dutyD.OdIQQ 
B) Preparation for PM document, service report.4"G_RvzH 
B) Sourcing new equipment and spare parts to production

2) Process managementKtQAm}
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A) Overall control to processes as individual process owner. W],A4[13 
A) Continuous improvement to process capacity.V: `!PY 
A) Develop new process introduction to productionA.r,~mLQ 
B) Preparation for process document, validation report.

Professional CompetencesDGm<^#< 
 Solid understanding on Microelectronic technology -{HRwDU{' 
 Practice and experience in Foundry, Wafer manufacturing<q)ZsaX0! 
 Practice and experience in Semiconductor Packaging Process)9nrBw(n 
 Practice and experience in electronic product assembly technology

Qualifications# p IEa 
 Bachelor degree or above, major in Microelectronics\electronicsk3>}o'4 ^ 
 3 or more years semiconductor packaging production or related experience1&zjIYQ5N 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesc~A-? 
 Ability to use analysis tools, like MinitabxLsYzzg 
 Ability to use quality control tools, SPC, Six Sigma1Raz> 
 Experience of lean manufacturing ^DDkD=.' 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510