Equipment & Process Engineer英语读写即可

1) Equipment managementkFf]QG 
A) Overall control to equipments as individual equipments owner. @eYqi_*k 
A) Continuous improvement to OEE.,}C3}Lf  
A) Repairing by on call or shift on dutye?HwxRK 
B) Preparation for PM document, service report.9L;@QP1V 
B) Sourcing new equipment and spare parts to production

2) Process managementyqr;IjWLA\ 
A) Overall control to processes as individual process owner. %xPA_"+(  
A) Continuous improvement to process capacity.5|.0Sk& 
A) Develop new process introduction to productionMd;5<yk{ 
B) Preparation for process document, validation report.

Professional Competencesz5BE|J 
 Solid understanding on Microelectronic technology [qBP. 
 Practice and experience in Foundry, Wafer manufacturing"\aO
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 Practice and experience in Semiconductor Packaging Process * I0@,iR 
 Practice and experience in electronic product assembly technology

Qualifications*QisPYJ?Q 
 Bachelor degree or above, major in Microelectronics\electronicso+ Y$_- 
 3 or more years semiconductor packaging production or related experienceoBlq~j _o 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences
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 Ability to use analysis tools, like Minitabw,ED><^ 
 Ability to use quality control tools, SPC, Six SigmaQ2=Cj~Ud 
 Experience of lean manufacturingH V0R ,m  
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510