Equipment & Process Engineer英语读写即可

1) Equipment management?14B,7)* 
A) Overall control to equipments as individual equipments owner.  WGZ8s} 
A) Continuous improvement to OEE.i Ca/Ggg 
A) Repairing by on call or shift on dutyR<#gfr:b 
B) Preparation for PM document, service report.]|<y
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B) Sourcing new equipment and spare parts to production

2) Process management,<[;e |<# 
A) Overall control to processes as individual process owner. 4C@4`G4 
A) Continuous improvement to process capacity.R/osM: 
A) Develop new process introduction to productiony*J
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B) Preparation for process document, validation report.

Professional CompetencesQLNV:T#M 
 Solid understanding on Microelectronic technology V ERE!n"% 
 Practice and experience in Foundry, Wafer manufacturing`2D,]@9 
 Practice and experience in Semiconductor Packaging ProcessT[FSr1yC 
 Practice and experience in electronic product assembly technology

Qualifications@ap4RM8* 
 Bachelor degree or above, major in Microelectronics\electronics5Ge=6@oJ 
 3 or more years semiconductor packaging production or related experience^k uahm 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences@AFeY;-v 
 Ability to use analysis tools, like Minitabd<=.R @n, 
 Ability to use quality control tools, SPC, Six SigmaB0bnR3w* 
 Experience of lean manufacturing={j2B)gzZ 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510