Equipment & Process Engineer英语读写即可

1) Equipment managementizJ8vY 
A) Overall control to equipments as individual equipments owner. TzCU1[RM 
A) Continuous improvement to OEE.=u9
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A) Repairing by on call or shift on duty hH<#biN  
B) Preparation for PM document, service report.y\4+Zvj 
B) Sourcing new equipment and spare parts to production

2) Process managementzI@c\~ 
A) Overall control to processes as individual process owner. hIyeTT. 
A) Continuous improvement to process capacity.O`r&VA 
A) Develop new process introduction to productionK=rl-)SOx 
B) Preparation for process document, validation report.

Professional Competences~a%
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 Solid understanding on Microelectronic technology (O^$`l+*0) 
 Practice and experience in Foundry, Wafer manufacturing8Xf)H 
 Practice and experience in Semiconductor Packaging ProcessCI,q @V# 
 Practice and experience in electronic product assembly technology

Qualifications# 7J!I^`a 
 Bachelor degree or above, major in Microelectronics\electronicsMRFaJWu_ 
 3 or more years semiconductor packaging production or related experience-cm_Wy  
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencest4X?o= H 
 Ability to use analysis tools, like Minitab
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 Ability to use quality control tools, SPC, Six Sigma0._|NM8 
 Experience of lean manufacturing7/#pP[i7b 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510