Equipment & Process Engineer英语读写即可

1) Equipment managementT{{Os,09 
A) Overall control to equipments as individual equipments owner. 4l<b!UIJr 
A) Continuous improvement to OEE.^wg[+,#ZP5 
A) Repairing by on call or shift on duty ~hBL"]2EZ 
B) Preparation for PM document, service report.n.(c"6E 
B) Sourcing new equipment and spare parts to production

2) Process managementi f3]al 
A) Overall control to processes as individual process owner. LS$
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A) Continuous improvement to process capacity.;qy%5l L 
A) Develop new process introduction to productionVNY+lc)ct@ 
B) Preparation for process document, validation report.

Professional Competences.aYv3E; 
 Solid understanding on Microelectronic technology g[ZW;;6 
 Practice and experience in Foundry, Wafer manufacturingIi ;!:H  
 Practice and experience in Semiconductor Packaging Process[ld,Pp 
 Practice and experience in electronic product assembly technology

QualificationsA*}3P\}*Y 
 Bachelor degree or above, major in Microelectronics\electronicsz 4<FHft 
 3 or more years semiconductor packaging production or related experienceJM96KgY  
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences(K33"82; 
 Ability to use analysis tools, like Minitab1D<")2; 
 Ability to use quality control tools, SPC, Six Sigma)c)|Q+.b`q 
 Experience of lean manufacturingG\(Ez/- 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510