Equipment & Process Engineer英语读写即可

1) Equipment managementCvg+5A 
A) Overall control to equipments as individual equipments owner. SG{}\ 
A) Continuous improvement to OEE.isbq3|X$9^ 
A) Repairing by on call or shift on dutyMuR0]t
 
B) Preparation for PM document, service report.;tr# .?4Aw 
B) Sourcing new equipment and spare parts to production

2) Process management/"$5G5>d  
A) Overall control to processes as individual process owner. z[@dp~^T 
A) Continuous improvement to process capacity.!~ x[_!P 
A) Develop new process introduction to productionDJgHkb 
B) Preparation for process document, validation report.

Professional Competences4!A?W=e 
 Solid understanding on Microelectronic technology =eZ3 AHk 
 Practice and experience in Foundry, Wafer manufacturing&@-6eu 
 Practice and experience in Semiconductor Packaging ProcessdCbA@H$m 
 Practice and experience in electronic product assembly technology

Qualifications%b
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 Bachelor degree or above, major in Microelectronics\electronicsU=)y={wm( 
 3 or more years semiconductor packaging production or related experience.K[D! 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competencesld1Yt<(2 
 Ability to use analysis tools, like Minitab\qFMb'L( 
 Ability to use quality control tools, SPC, Six Sigmaptua@*zD 
 Experience of lean manufacturing^nne|0 Q 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510