Equipment & Process Engineer英语读写即可

1) Equipment management9ER`0DDS 
A) Overall control to equipments as individual equipments owner. QwqMrjKDE 
A) Continuous improvement to OEE.37oE<^Q`, 
A) Repairing by on call or shift on duty\Dqllx
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B) Preparation for PM document, service report.dO2~fJ<|J 
B) Sourcing new equipment and spare parts to production

2) Process managementd]&+i;y1b 
A) Overall control to processes as individual process owner. Uc
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A) Continuous improvement to process capacity.e?<Er4) 
A) Develop new process introduction to production3]h_CwqQc 
B) Preparation for process document, validation report.

Professional Competences<=KTS>E8 
 Solid understanding on Microelectronic technology [:rxdP%A 
 Practice and experience in Foundry, Wafer manufacturing!(1f;|hY 
 Practice and experience in Semiconductor Packaging ProcessZu;N+qj 
 Practice and experience in electronic product assembly technology

QualificationsFy1TFJ_* 
 Bachelor degree or above, major in Microelectronics\electronicsLeVD`qp 
 3 or more years semiconductor packaging production or related experience%pxQ`.)c 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetenceswyMTEYx 
 Ability to use analysis tools, like Minitab pmuM,Z{` 
 Ability to use quality control tools, SPC, Six Sigma{UzSUKo 
 Experience of lean manufacturingO D{74] 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510