Equipment & Process Engineer英语读写即可

1) Equipment managemente*(xMN 
A) Overall control to equipments as individual equipments owner. ci)yP 
A) Continuous improvement to OEE.cq"P0Mq_ 
A) Repairing by on call or shift on dutyR X_B>Qv 
B) Preparation for PM document, service report.H>y@ G0 
B) Sourcing new equipment and spare parts to production

2) Process management=<O0[|._d 
A) Overall control to processes as individual process owner. \'z@:FD 
A) Continuous improvement to process capacity.6!Z1npK\Z 
A) Develop new process introduction to production*b8S" 
B) Preparation for process document, validation report.

Professional Competences\E+6bwG 
 Solid understanding on Microelectronic technology [ ]G+n 
 Practice and experience in Foundry, Wafer manufacturing~%nJ 
 Practice and experience in Semiconductor Packaging ProcessHM&hu 5} 
 Practice and experience in electronic product assembly technology

QualificationsyHEmr-W\+ 
 Bachelor degree or above, major in Microelectronics\electronics*n1}]~ 
 3 or more years semiconductor packaging production or related experience* m$Osz 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesW/`h,8c'| 
 Ability to use analysis tools, like MinitabSz C!5OF> 
 Ability to use quality control tools, SPC, Six Sigma}MO=}-iQ 
 Experience of lean manufacturingj& ?e5+  
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510