Equipment & Process Engineer英语读写即可

1) Equipment managementM!\dd'^ 
A) Overall control to equipments as individual equipments owner. }GM<lP6P~ 
A) Continuous improvement to OEE.8EodH( 
A) Repairing by on call or shift on duty1}0AJC
o7 
B) Preparation for PM document, service report.wdS3"` 
B) Sourcing new equipment and spare parts to production

2) Process managementsO2vqBSo 
A) Overall control to processes as individual process owner.
\Kx(+ka 
A) Continuous improvement to process capacity.-g ]|A>G 
A) Develop new process introduction to production\. P""z 
B) Preparation for process document, validation report.

Professional CompetencesTd~vA
2  
 Solid understanding on Microelectronic technology ]-mHyljsS 
 Practice and experience in Foundry, Wafer manufacturing=$rXP" 
 Practice and experience in Semiconductor Packaging Process $XxD3}|Y 
 Practice and experience in electronic product assembly technology

Qualifications|R&|c) Ed 
 Bachelor degree or above, major in Microelectronics\electronicszv{!v.  
 3 or more years semiconductor packaging production or related experienceb*Ycf 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences\3 Yf[0 
 Ability to use analysis tools, like MinitabUmsHaGv2 
 Ability to use quality control tools, SPC, Six Sigmay ~g&&#I& 
 Experience of lean manufacturingjG1w@}K4  
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510