Equipment & Process Engineer英语读写即可

1) Equipment managementiz-x-)\q# 
A) Overall control to equipments as individual equipments owner. 3 IB-s@ 
A) Continuous improvement to OEE.0n [ 
A) Repairing by on call or shift on dutyH9d!tpkU( 
B) Preparation for PM document, service report.aTYql' 
B) Sourcing new equipment and spare parts to production

2) Process managementvU";CB  
A) Overall control to processes as individual process owner. ovPJA.h 
A) Continuous improvement to process capacity.)6wHU< 
A) Develop new process introduction to production/ xD qx(j 
B) Preparation for process document, validation report.

Professional Competencesx8>,fB{) 
 Solid understanding on Microelectronic technology dP/M!{e= 
 Practice and experience in Foundry, Wafer manufacturing'g<?[&wt!z 
 Practice and experience in Semiconductor Packaging Process66{d^Z, 
 Practice and experience in electronic product assembly technology

Qualifications>Mcg1p*7? 
 Bachelor degree or above, major in Microelectronics\electronicsf.Y@4amY45 
 3 or more years semiconductor packaging production or related experience#jN]maj 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences 4{/=I!5 
 Ability to use analysis tools, like MinitabiZ{Bp\1#h 
 Ability to use quality control tools, SPC, Six Sigma7Y?ksvS 
 Experience of lean manufacturing )*t4P_Fc5 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510