Equipment & Process Engineer英语读写即可

1) Equipment management625zR f 
A) Overall control to equipments as individual equipments owner. w`}6+~T<-V 
A) Continuous improvement to OEE.,)uz^a( 
A) Repairing by on call or shift on dutyX.t$!LN^.? 
B) Preparation for PM document, service report.Des;@`}a 
B) Sourcing new equipment and spare parts to production

2) Process management1N][qm!fLu 
A) Overall control to processes as individual process owner. $u.aBp^= 
A) Continuous improvement to process capacity.yS(o}u
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A) Develop new process introduction to production>47WwZ2p 
B) Preparation for process document, validation report.

Professional CompetencesA_ e}j>C-< 
 Solid understanding on Microelectronic technology bUu:&O*z 
 Practice and experience in Foundry, Wafer manufacturing!Z$1JtBk6> 
 Practice and experience in Semiconductor Packaging ProcessPH*q-y 
 Practice and experience in electronic product assembly technology

Qualifications>T@bG'(M 
 Bachelor degree or above, major in Microelectronics\electronics8D3S-W[E 
 3 or more years semiconductor packaging production or related experience9aZ/0.U 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting Competences\QZJL2~ 
 Ability to use analysis tools, like MinitabD'^Dx&95u 
 Ability to use quality control tools, SPC, Six SigmaO8Ws.o 
 Experience of lean manufacturingUx![>x< 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510