Equipment & Process Engineer英语读写即可

1) Equipment management9kyRX.| 
A) Overall control to equipments as individual equipments owner. YPr+J 
A) Continuous improvement to OEE.m.]EKo b 
A) Repairing by on call or shift on dutyIx,!{[XZT 
B) Preparation for PM document, service report.apgjl?(K
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B) Sourcing new equipment and spare parts to production

2) Process management`1*r~W2K} 
A) Overall control to processes as individual process owner. ~\zF %s 
A) Continuous improvement to process capacity.c**#DI 
A) Develop new process introduction to productionD M\vGd"} 
B) Preparation for process document, validation report.

Professional Competences(H"":}E6T 
 Solid understanding on Microelectronic technology >,HBLYg:@  
 Practice and experience in Foundry, Wafer manufacturingk3]F8Hm  
 Practice and experience in Semiconductor Packaging Process/~R|9 
 Practice and experience in electronic product assembly technology

Qualifications-X%cK}e ` 
 Bachelor degree or above, major in Microelectronics\electronics 5-/l[ 
 3 or more years semiconductor packaging production or related experience}K89k>5# 
 Plenty of PM experience to semiconductor packaging and manufacturing equipments.

Supporting CompetencesIP<tD:L* 
 Ability to use analysis tools, like Minitab![b/H&ovU 
 Ability to use quality control tools, SPC, Six SigmaySRE4#:#&` 
 Experience of lean manufacturing(PQ-' 
 Fluent English communication skill

电邮：jack.zhou@i-cai.com.cn

MSN ：tangku6@hotmail.com

QQ ：1492047121

网址：www.i-cai.com.cn

微博：http://weibo.com/u/1830720510